Invention Grant
- Patent Title: Semiconductor device and manufacturing method thereof
- Patent Title (中): 半导体装置及其制造方法
-
Application No.: US12700502Application Date: 2010-02-04
-
Publication No.: US08314464B2Publication Date: 2012-11-20
- Inventor: Masayoshi Iwayama , Yoshiaki Asao , Takeshi Kajiyama
- Applicant: Masayoshi Iwayama , Yoshiaki Asao , Takeshi Kajiyama
- Applicant Address: JP Tokyo
- Assignee: Kabushiki Kaisha Toshiba
- Current Assignee: Kabushiki Kaisha Toshiba
- Current Assignee Address: JP Tokyo
- Agency: Knobbe, Martens, Olson & Bear LLP
- Priority: JP2009-214809 20090916
- Main IPC: H01L29/78
- IPC: H01L29/78

Abstract:
First semiconductor layers are in source/drain regions on the semiconductor substrate. A second semiconductor layer comprises first portions on the first semiconductor layers and a second portion in a linear form in a channel region between the source/drain regions. A gate electrode is around the second portion of the second semiconductor layer via an insulating film. A film thickness of the second portion of the second semiconductor layer is smaller than a film thickness of the first portion of the second semiconductor layer.
Public/Granted literature
- US20110062421A1 SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF Public/Granted day:2011-03-17
Information query
IPC分类: