Invention Grant
- Patent Title: Semiconductor integrated circuit for communication
- Patent Title (中): 半导体集成电路通讯
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Application No.: US12917135Application Date: 2010-11-01
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Publication No.: US08315579B2Publication Date: 2012-11-20
- Inventor: Ryoji Furuya , Kazuhisa Okada , Hiroaki Matsui
- Applicant: Ryoji Furuya , Kazuhisa Okada , Hiroaki Matsui
- Applicant Address: JP Kanagawa
- Assignee: Renesas Electronics Corporation
- Current Assignee: Renesas Electronics Corporation
- Current Assignee Address: JP Kanagawa
- Agency: Mattingly & Malur, PC
- Priority: JP2005-052288 20050228
- Main IPC: H04B1/04
- IPC: H04B1/04 ; H04B1/00

Abstract:
The present invention provides a semiconductor integrated circuit for communication (RF IC) realizing high yield without deteriorating a carrier leak characteristic even when a modulation circuit is formed by using cheep parts with large variations. In a semiconductor integrated circuit (RF IC) including: an input circuit constructed by a differential amplifier circuit and a level shifter, which is provided on the ante stage of a mixer of a differential circuit called a Gilbert Cell; and a modulation circuit that performs modulation by adding an I/Q signal and a carrier wave signal, a calibration circuit for canceling a DC offset in an output of the input circuit is provided.
Public/Granted literature
- US20110053529A1 SEMICONDUCTOR INTEGRATED CIRCUIT FOR COMMUNICATION Public/Granted day:2011-03-03
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