Invention Grant
- Patent Title: Method and system of embedded microlens
- Patent Title (中): 嵌入式微透镜的方法和系统
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Application No.: US12987930Application Date: 2011-01-10
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Publication No.: US08319303B2Publication Date: 2012-11-27
- Inventor: Jianping Yang , Herb Huang , JieGuang Huo
- Applicant: Jianping Yang , Herb Huang , JieGuang Huo
- Applicant Address: CN Shanghai
- Assignee: Semiconductor Manufacturing International (Shanghai) Corporation
- Current Assignee: Semiconductor Manufacturing International (Shanghai) Corporation
- Current Assignee Address: CN Shanghai
- Agency: Kilpatrick Townsend & Stockton LLP
- Priority: CN201010022718 20100112
- Main IPC: H01L31/0232
- IPC: H01L31/0232
Abstract:
An image sensor includes an array of photo-sensing regions formed in a semiconductor substrate, a dielectric layer over the array of photo-sensing regions, and an array of microlenses formed in the dielectric layer. Each of the microlenses is center-aligned over one of the photo-sensing regions and has a truncated plano-convex shape. The microlenses have an index of refraction that is higher than the dielectric layer's refraction index. Each of the microlenses has a smooth circular top, a flat circular bottom, and a curved circumferential side convex towards the semiconductor substrate.
Public/Granted literature
- US20120012960A1 METHOD AND SYSTEM OF EMBEDDED MICROLENS Public/Granted day:2012-01-19
Information query
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