Invention Grant
US08319326B2 Stacked die with vertically-aligned conductors and methods for making the same
有权
具有垂直对准导体的堆叠裸片及其制造方法
- Patent Title: Stacked die with vertically-aligned conductors and methods for making the same
- Patent Title (中): 具有垂直对准导体的堆叠裸片及其制造方法
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Application No.: US12895098Application Date: 2010-09-30
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Publication No.: US08319326B2Publication Date: 2012-11-27
- Inventor: Nir J. Wakrat , Nick Seroff , Anthony Fai
- Applicant: Nir J. Wakrat , Nick Seroff , Anthony Fai
- Applicant Address: US CA Cupertino
- Assignee: Apple Inc.
- Current Assignee: Apple Inc.
- Current Assignee Address: US CA Cupertino
- Agency: Kramer Levin Naftalis & Frankel LLP
- Main IPC: H01L23/02
- IPC: H01L23/02
Abstract:
Stacked die having vertically-aligned conductors and methods for making the same are disclosed for providing a non-volatile memory, such as flash memory (e.g., NAND flash memory), for use in an electronic device.
Public/Granted literature
- US20120084478A1 STACKED DIE WITH VERTICALLY-ALIGNED CONDUCTORS AND METHODS FOR MAKING THE SAME Public/Granted day:2012-04-05
Information query
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