Disc-type coil lamination work is facilitated, and a manufacturing cost is reduced. A plurality of disc-type coils each including a discoid insulating substrate 1, conductor patterns 2 arranged on the insulating substrate 1, and holes 7 configured to form lamination through holes 10 bored in the insulating substrate 1 are laminated by connecting the lamination through holes 10. The holes 7 configured to form the lamination through holes 10 are provided on the outer circumferential side or the inner circumferential side of the conductor patterns 2, and a leading pattern 3 and a terminating pattern 4 serving as terminal portions of each conductor pattern 2 are drawn to the holes 7 and connected, thereby forming the lamination through holes 10.