Invention Grant
- Patent Title: Method and apparatus for shaping a linear segment
- Patent Title (中): 用于成形线性段的方法和装置
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Application No.: US12173638Application Date: 2008-07-15
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Publication No.: US08319775B2Publication Date: 2012-11-27
- Inventor: Jack Gershfeld
- Applicant: Jack Gershfeld
- Agent Vladimir Khiterer
- Main IPC: G06T11/20
- IPC: G06T11/20

Abstract:
A method and apparatus for shaping a linear segment is disclosed. The method comprises the steps of selecting a dynamic bend point, determining a primary snap point based on the location of the dynamic bend point in one of four predetermined regions and snapping the dynamic bend point to the primary snap point. A secondary snap point is also determined and the dynamic bend point is snapped either to the primary snap point or to the secondary snap point, depending on the location of the dynamic bend point inside or outside a predetermined secondary snap region.
Public/Granted literature
- US20100013862A1 METHOD AND APPARATUS FOR SHAPING A LINEAR SEGMENT Public/Granted day:2010-01-21
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