Invention Grant
- Patent Title: Cooling high performance computer systems
- Patent Title (中): 冷却高性能计算机系统
-
Application No.: US12901933Application Date: 2010-10-11
-
Publication No.: US08320121B2Publication Date: 2012-11-27
- Inventor: Sylvio Bisson , Willi Manfred Lotz
- Applicant: Sylvio Bisson , Willi Manfred Lotz
- Applicant Address: CA Ottawa
- Assignee: Liquid Computing Corporation
- Current Assignee: Liquid Computing Corporation
- Current Assignee Address: CA Ottawa
- Agency: Teitelbaum & MacLean
- Agent Neil Teitelbaum; Doug MacLean
- Main IPC: H05K7/20
- IPC: H05K7/20

Abstract:
A computer system may include a chassis defining a front and a rear. The chassis may include a vertically oriented midplane disposed therein, the midplane including a plurality of front module slots for receiving front electronic modules from the front of the chassis, and a plurality of rear module slots for receiving rear electronic modules from the rear of the chassis. A cooling system may be provided within the chassis and may generate an upwardly-directed front air flow within the chassis directed at selected ones of the front electronic modules and an upwardly-directed rear air flow within the chassis directed at selected ones of the rear electronic modules. The front air flow is separate from and independent of the rear air flow. The selected front and rear electronic modules may be disposed in the chassis so as to separate the front air flow into a plurality of substantially equal front air streams and the rear air flow into a plurality of substantially equal rear air streams, respectively.
Public/Granted literature
- US20110080701A1 COOLING HIGH PERFORMANCE COMPUTER SYSTEMS Public/Granted day:2011-04-07
Information query