Invention Grant
US08321193B2 Support system and method for manufacturing integrated circuit 有权
集成电路制造支持系统及方法

  • Patent Title: Support system and method for manufacturing integrated circuit
  • Patent Title (中): 集成电路制造支持系统及方法
  • Application No.: US12526621
    Application Date: 2009-06-15
  • Publication No.: US08321193B2
    Publication Date: 2012-11-27
  • Inventor: Shuntaro Seno
  • Applicant: Shuntaro Seno
  • Applicant Address: JP Tokyo
  • Assignee: Hitachi, Ltd.
  • Current Assignee: Hitachi, Ltd.
  • Current Assignee Address: JP Tokyo
  • Agency: Brundidge & Stanger, P.C.
  • International Application: PCT/JP2009/002708 WO 20090615
  • International Announcement: WO2010/146623 WO 20101223
  • Main IPC: G06F17/50
  • IPC: G06F17/50
Support system and method for manufacturing integrated circuit
Abstract:
An integrated circuit including an I/O register, wherein based on the behavior level design data, I/O register access information is generated. Then, based on the I/O register access information and association of an SW address with an HW address, address map information is generated. The SW address being used when the processor device accesses the I/O register, and the HW address being used when the user logical circuit accesses the I/O register. Based on the behavior level design data and the address map information, behavior level design data is generated.
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