Invention Grant
- Patent Title: Support system and method for manufacturing integrated circuit
- Patent Title (中): 集成电路制造支持系统及方法
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Application No.: US12526621Application Date: 2009-06-15
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Publication No.: US08321193B2Publication Date: 2012-11-27
- Inventor: Shuntaro Seno
- Applicant: Shuntaro Seno
- Applicant Address: JP Tokyo
- Assignee: Hitachi, Ltd.
- Current Assignee: Hitachi, Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Brundidge & Stanger, P.C.
- International Application: PCT/JP2009/002708 WO 20090615
- International Announcement: WO2010/146623 WO 20101223
- Main IPC: G06F17/50
- IPC: G06F17/50

Abstract:
An integrated circuit including an I/O register, wherein based on the behavior level design data, I/O register access information is generated. Then, based on the I/O register access information and association of an SW address with an HW address, address map information is generated. The SW address being used when the processor device accesses the I/O register, and the HW address being used when the user logical circuit accesses the I/O register. Based on the behavior level design data and the address map information, behavior level design data is generated.
Public/Granted literature
- US20100318328A1 DESIGN SUPPORT SYSTEM AND METHOD FOR MANUFACTURING INTEGRATED CIRCUIT Public/Granted day:2010-12-16
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