Invention Grant
- Patent Title: Device housing
- Patent Title (中): 设备外壳
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Application No.: US12577906Application Date: 2009-10-13
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Publication No.: US08322560B2Publication Date: 2012-12-04
- Inventor: Xiao-Jiang Jiang , Shuo-Hsiu Chang , Wei Deng
- Applicant: Xiao-Jiang Jiang , Shuo-Hsiu Chang , Wei Deng
- Applicant Address: CN Shenzhen, Guangdong Province TW Tu-Cheng, New Taipei
- Assignee: Hong Fu Jin Precision Industry (Shen Zhen) Co., Ltd.,Hon Hai Precision Industry Co., Ltd.
- Current Assignee: Hong Fu Jin Precision Industry (Shen Zhen) Co., Ltd.,Hon Hai Precision Industry Co., Ltd.
- Current Assignee Address: CN Shenzhen, Guangdong Province TW Tu-Cheng, New Taipei
- Agency: Altis Law Group, Inc.
- Main IPC: B65D6/00
- IPC: B65D6/00 ; B65D6/28 ; B65D8/04 ; B65D8/18
Abstract:
A device housing includes a glass plate and a plastic frame. The glass plate is received in the plastic frame. The glass plate forms a positioning surface in an edge. The plastic frame and the glass plate are integrally formed, thus the plastic frame connects the glass plate with no gap, and the plastic frame forms a connecting portion combined with the positioning surface.
Public/Granted literature
- US20110049139A1 DEVICE HOUSING Public/Granted day:2011-03-03
Information query
