Invention Grant
- Patent Title: Thermal compensated stampers/imprinters
- Patent Title (中): 热补偿压模/冲压机
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Application No.: US13043327Application Date: 2011-03-08
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Publication No.: US08323018B2Publication Date: 2012-12-04
- Inventor: Gennady (Gene) Gauzner , Hong Ying Wang
- Applicant: Gennady (Gene) Gauzner , Hong Ying Wang
- Applicant Address: US CA Cupertino
- Assignee: Seagate Technology LLC
- Current Assignee: Seagate Technology LLC
- Current Assignee Address: US CA Cupertino
- Main IPC: B29C33/38
- IPC: B29C33/38 ; B29C59/02

Abstract:
A method of manufacturing a stamper/imprinter for patterning a recording medium via thermally assisted nano-imprint lithography, comprising steps of: selecting a recording medium for patterning, comprising a substrate with a first coefficient of thermal expasnsion (CTE); providing a first stamper/imprinter comprising a topographically patterned surface having a correspondence to a selected pattern to be formed in a surface of the medium; providing a sheet of a material having a second CTE matching the first CTE; molding a layer of a polymeric material surrounding the sheet of material and having a surface in conformal contact with the topographically patterned surface of the first stamper/imprinter; and separating the layer of polymeric material from the patterned surface of the first stamper/imprinter to form a second stamper/imprinter comprising a topographically patterned stamping/imprinting surface having a correspondence to the selected pattern.
Public/Granted literature
- US20120058312A1 THERMAL COMPENSATED STAMPERS/IMPRINTERS Public/Granted day:2012-03-08
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