Invention Grant
US08324076B2 Micro-fluid ejection heads and methods for bonding substrates to supports
有权
微流体喷射头和将基底粘合到支撑体上的方法
- Patent Title: Micro-fluid ejection heads and methods for bonding substrates to supports
- Patent Title (中): 微流体喷射头和将基底粘合到支撑体上的方法
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Application No.: US12786462Application Date: 2010-05-25
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Publication No.: US08324076B2Publication Date: 2012-12-04
- Inventor: David Laurier Bernard , Paul William Dryer , Andrew Lee McNees
- Applicant: David Laurier Bernard , Paul William Dryer , Andrew Lee McNees
- Applicant Address: US KY Lexington
- Assignee: Lexmark International, Inc.
- Current Assignee: Lexmark International, Inc.
- Current Assignee Address: US KY Lexington
- Main IPC: H01L21/30
- IPC: H01L21/30
Abstract:
A substantially planar micro-fluid ejection device, where the micro-fluid ejection head is hermetically sealed and bonded to a support material, and a method of bonding a silicon device, such as a micro-fluid ejection head, to a support material.
Public/Granted literature
- US20100230047A1 MICRO-FLUID EJECTION HEADS AND METHODS FOR BONDING SUBSTRATES TO SUPPORTS Public/Granted day:2010-09-16
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