Invention Grant
- Patent Title: Resin composition for encapsulating an electronic tag, a resin-encapsulated electronic tag and a method for producing the same
- Patent Title (中): 用于封装电子标签的树脂组合物，树脂封装的电子标签及其制造方法
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Application No.: US12527434Application Date: 2008-04-07
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Publication No.: US08324308B2Publication Date: 2012-12-04
- Inventor: Satoru Kinouchi
- Applicant: Satoru Kinouchi
- Applicant Address: JP Tokyo
- Assignee: Idemitsu Kosan Co., Ltd.
- Current Assignee: Idemitsu Kosan Co., Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP2007-111780 20070420
- International Application: PCT/JP2008/056860 WO 20080407
- International Announcement: WO2008/132972 WO 20081106
- Main IPC: C08K3/40
- IPC: C08K3/40
Abstract:
A resin composition for encapsulating an electronic tag which includes a thermoplastic resin and a flat glass fiber and does not include a thermoplastic elastomer, wherein the thermoplastic resin is at least one selected from polycarbonate, syndiotactic polystyrene and polyphenylene sulfide.
Public/Granted literature
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