Invention Grant
- Patent Title: Housings for electronic components
- Patent Title (中): 电子元器件外壳
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Application No.: US11873303Application Date: 2007-10-16
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Publication No.: US08324515B2Publication Date: 2012-12-04
- Inventor: James F. Stevenson , David C. Vacanti , Siu-Ching D. Lui
- Applicant: James F. Stevenson , David C. Vacanti , Siu-Ching D. Lui
- Applicant Address: US NJ Morristown
- Assignee: Honeywell International Inc.
- Current Assignee: Honeywell International Inc.
- Current Assignee Address: US NJ Morristown
- Agency: Lowe Graham Jones PLLC
- Main IPC: H01L23/06
- IPC: H01L23/06 ; B32B3/00 ; B32B27/04
Abstract:
Housings for electrical or electronic components made using braid or woven fabric sheets having multiple sections treated with different materials as well as processes and materials for making such housings are disclosed.
Public/Granted literature
- US20090095523A1 HOUSINGS FOR ELECTRONIC COMPONENTS Public/Granted day:2009-04-16
Information query
IPC分类:
