Invention Grant
- Patent Title: Reflow apparatus, reflow method, and package apparatus
- Patent Title (中): 回流装置，回流方法和包装装置
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Application No.: US12591821Application Date: 2009-12-02
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Publication No.: US08324522B2Publication Date: 2012-12-04
- Inventor: Minill Kim , Kwang Yong Lee , Jonggi Lee , Ji-Seok Hong
- Applicant: Minill Kim , Kwang Yong Lee , Jonggi Lee , Ji-Seok Hong
- Applicant Address: KR Gyeonggi-do
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Gyeonggi-do
- Agency: Harness, Dickey & Pierce, PLC
- Priority: KR10-2009-0004231 20090119
- Main IPC: B23K3/00
- IPC: B23K3/00 ; B23K26/00
Abstract:
Provided is an apparatus for performing a reflow process of a solder ball provided to a semiconductor chip. The reflow apparatus may include a coil, a support member and a moving member. The coil may receive a current from a power supply to heat the solder ball using an induced heating method. The support member may be disposed on the front or the rear of the coil and may support a printed circuit board on which a semiconductor chip is mounted. The moving member may move the printed circuit board so that the printed circuit object passes through an internal space surrounded by the coil.
Public/Granted literature
- US20100181293A1 Reflow apparatus, Reflow method, and package apparatus Public/Granted day:2010-07-22
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