Invention Grant
US08324721B2 Integrated shunt resistor with external contact in a semiconductor package
有权
在半导体封装中具有外部接触的集成分流电阻
- Patent Title: Integrated shunt resistor with external contact in a semiconductor package
- Patent Title (中): 在半导体封装中具有外部接触的集成分流电阻
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Application No.: US13412347Application Date: 2012-03-05
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Publication No.: US08324721B2Publication Date: 2012-12-04
- Inventor: Ubol Udompanyavit , Steve Kummerl
- Applicant: Ubol Udompanyavit , Steve Kummerl
- Applicant Address: US TX Dallas
- Assignee: Texas Instruments Incorporated
- Current Assignee: Texas Instruments Incorporated
- Current Assignee Address: US TX Dallas
- Agent Steven A. Shaw; W. James Brady; Frederick J. Telecky, Jr.
- Main IPC: H01L23/48
- IPC: H01L23/48 ; H01L23/52
Abstract:
An integrated circuit package that comprises a lead frame 105, an integrated circuit located on the lead frame and a shunt resistor coupled to the integrated circuit. The shunt resistor has a lower temperature coefficient of resistance than the lead frame, and the lead frame has a lower resistivity than the shunt resistor. The shunt resistor has a low-resistance coupling to external leads of the lead frame, or, the shunt resistor has its own integrated external leads.
Public/Granted literature
- US20120199951A1 INTEGRATED SHUNT RESISTOR WITH EXTERNAL CONTACT IN A SEMICONDUCTOR PACKAGE Public/Granted day:2012-08-09
Information query
IPC分类:
