Invention Grant
- Patent Title: Silicon condenser microphone
- Patent Title (中): 硅电容麦克风
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Application No.: US12855544Application Date: 2010-08-12
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Publication No.: US08325950B2Publication Date: 2012-12-04
- Inventor: Hai-Feng Li , Rui Zhang
- Applicant: Hai-Feng Li , Rui Zhang
- Applicant Address: CN Shenzhen US CA La Verne
- Assignee: AAC Acoustic Technologies (Shenzhen) Co., Ltd.,American Audio Components Inc.
- Current Assignee: AAC Acoustic Technologies (Shenzhen) Co., Ltd.,American Audio Components Inc.
- Current Assignee Address: CN Shenzhen US CA La Verne
- Agency: IPro, Inc.
- Agent Na Xu
- Priority: CN201010119951 20100308
- Main IPC: H04R25/00
- IPC: H04R25/00

Abstract:
Disclosed is a silicon condenser microphone including a backplate having a plurality of perforations therethrough, a diaphragm opposed from the backplate for forming a capacitor. The diaphragm includes a first part and a second part received in the first part, the second part being capable of vibrating relative to the backplate. The first part is connected to the ground and the second part is connected to a bias voltage.
Public/Granted literature
- US20110216922A1 SILICON CONDENSER MICROPHONE Public/Granted day:2011-09-08
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