Invention Grant
- Patent Title: Interface module
- Patent Title (中): 接口模块
-
Application No.: US12375729Application Date: 2007-07-10
-
Publication No.: US08327389B2Publication Date: 2012-12-04
- Inventor: Marc Lamberton , David Mansutti , Olivier Bertin
- Applicant: Marc Lamberton , David Mansutti , Olivier Bertin
- Applicant Address: US TX Houston
- Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee Address: US TX Houston
- Priority: EP06300841 20060731
- International Application: PCT/EP2007/057059 WO 20070710
- International Announcement: WO2008/015083 WO 20080207
- Main IPC: G06F9/44
- IPC: G06F9/44 ; G06F15/16

Abstract:
An interface module for a telecommunications network service entity, the interface module being operable to communicate with an application provided on the telecommunications network service entity and a session layer of the telecommunications network service entity, the interface module comprising a generic container to communicate with the application and a protocol connector operable to communicate with an API of the session layer and the generic container, wherein the protocol connector is operable to receive a message from the protocol stack API in accordance with a corresponding protocol, and pass the message to the generic container, which passes the message to the application.
Public/Granted literature
- US20090257571A1 INTERFACE MODULE Public/Granted day:2009-10-15
Information query