Invention Grant
- Patent Title: Printed circuit board
- Patent Title (中): 印刷电路板
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Application No.: US12409544Application Date: 2009-03-24
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Publication No.: US08330047B2Publication Date: 2012-12-11
- Inventor: Voonyee Ho , Katsutoshi Kamei
- Applicant: Voonyee Ho , Katsutoshi Kamei
- Applicant Address: JP Osaka
- Assignee: Nitto Denko Corporation
- Current Assignee: Nitto Denko Corporation
- Current Assignee Address: JP Osaka
- Agency: Panitch Schwarze Belisario & Nadel LLP
- Priority: JP2008-095840 20080402
- Main IPC: H05K1/00
- IPC: H05K1/00

Abstract:
A first insulating layer is formed on a suspension body and a wiring trace is formed on the first insulating layer. In addition, a ground trace is formed on the first insulating layer so as to extend along the wiring trace on one side of the wiring trace with a spacing therebetween. A second insulating layer is formed on the first insulating layer to cover the wiring trace and the ground trace. On the second insulating layer, a wiring trace is formed at a position above the wiring trace. A third insulating layer is formed on the second insulating layer to cover the wiring trace. The width of the wiring trace is set larger than the width of the wiring trace. At least a partial region of the ground trace and at least a partial region of the wiring trace are opposite to each other with part of the second insulating layer sandwiched therebetween.
Public/Granted literature
- US20090250252A1 PRINTED CIRCUIT BOARD Public/Granted day:2009-10-08
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