Invention Grant
US08330048B2 Electromagnetic bandgap structure and printed circuit board having the same
失效
电磁带隙结构和具有相同功能的印刷电路板
- Patent Title: Electromagnetic bandgap structure and printed circuit board having the same
- Patent Title (中): 电磁带隙结构和具有相同功能的印刷电路板
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Application No.: US12650486Application Date: 2009-12-30
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Publication No.: US08330048B2Publication Date: 2012-12-11
- Inventor: Won Woo Cho , Young Soo Kim , Yoon Jung Kim , Dek Gin Yang , Myung Gun Chong , Hyung Ho Kim
- Applicant: Won Woo Cho , Young Soo Kim , Yoon Jung Kim , Dek Gin Yang , Myung Gun Chong , Hyung Ho Kim
- Applicant Address: KR Suwon, Gyunggi-do KR Pohang Univ. of Science, Gyeongsangbuk-do
- Assignee: Samsung Electro-Mechanics Co., Ltd.,Postech Academy-Industry Foundation
- Current Assignee: Samsung Electro-Mechanics Co., Ltd.,Postech Academy-Industry Foundation
- Current Assignee Address: KR Suwon, Gyunggi-do KR Pohang Univ. of Science, Gyeongsangbuk-do
- Agency: Blakely Sokoloff Taylor & Zafman LLP
- Priority: KR10-2009-0029964 20090407
- Main IPC: H05K9/00
- IPC: H05K9/00

Abstract:
Disclosed herein are an electromagnetic bandgap structure and a printed circuit board having the same. The bandgap structure includes a conductive layer including a plurality of conductive plates; and a metal layer disposed over or under the conductive layer and including a stitching pattern to electrically connect a first conductive plate to a second conductive plate of the plurality of conductive plates. The bandgap structure includes a spiral stitching pattern formed in a metal layer different from the conductive layer, thus offering a stop-band having a desired bandwidth in a compact structure.
Public/Granted literature
- US20100252319A1 ELECTROMAGNETIC BANDGAP STRUCTURE AND PRINTED CIRCUIT BOARD HAVING THE SAME Public/Granted day:2010-10-07
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