Invention Grant
US08331103B2 Wiring board, method of manufacturing same, tuner module, and electronic device
有权
接线板，制造方法，调谐器模块和电子设备
- Patent Title: Wiring board, method of manufacturing same, tuner module, and electronic device
- Patent Title (中): 接线板，制造方法，调谐器模块和电子设备
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Application No.: US12688490Application Date: 2010-01-15
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Publication No.: US08331103B2Publication Date: 2012-12-11
- Inventor: Shuichi Oka
- Applicant: Shuichi Oka
- Applicant Address: JP Tokyo
- Assignee: Sony Corporation
- Current Assignee: Sony Corporation
- Current Assignee Address: JP Tokyo
- Agency: Rockey, Depke & Lyons, LLC
- Agent Robert J. Depke
- Priority: JP2009-036081 20090219
- Main IPC: H05K1/16
- IPC: H05K1/16
Abstract:
Disclosed herein is a wiring board including: a shield layer; and n layers (n is an integer of two or more) of inductor wiring formed above the shield layer and forming an inductor; wherein of the n layers of inductor wiring, the inductor wiring closest to the shield layer has a smallest wiring area.
Public/Granted literature
- US20100208439A1 WIRING BOARD, METHOD OF MANUFACTURING SAME, TUNER MODULE, AND ELECTRONIC DEVICE Public/Granted day:2010-08-19
Information query
