Invention Grant
US08331185B2 Semiconductor device having electrical fuses with less power consumption and interconnection arrangement 有权
具有电功率消耗较小的电熔丝和互连配置的半导体器件

Semiconductor device having electrical fuses with less power consumption and interconnection arrangement
Abstract:
In fuse program circuits, fuse element FS is implemented using metal interconnect at third or higher layer of multilayer metal interconnect. In each fuse program circuit, program information and fuse select information are sequentially transferred using a scan flip-flops, and fuses are selectively and electrically blown one by one. The fuse program circuit provided with fuse elements that can be programmed even after packaging is implemented with low power consumption and a low occupation area.
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