Invention Grant
US08331824B2 Heating member having resistive heating layer and fusing device using the same
有权
具有电阻加热层的加热构件和使用其的定影装置
- Patent Title: Heating member having resistive heating layer and fusing device using the same
- Patent Title (中): 具有电阻加热层的加热构件和使用其的定影装置
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Application No.: US12782169Application Date: 2010-05-18
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Publication No.: US08331824B2Publication Date: 2012-12-11
- Inventor: Jin-Seung Choi , Seung-Jin Oh , Young-Chul Ko
- Applicant: Jin-Seung Choi , Seung-Jin Oh , Young-Chul Ko
- Applicant Address: KR Suwon-Si
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Suwon-Si
- Agency: Staas & Halsey LLP
- Priority: KR10-2009-0064086 20090714
- Main IPC: G03G15/20
- IPC: G03G15/20
Abstract:
Disclosed are a heating member having a resistive heating layer and a fusing device using the heating member. The heating member includes the resistive heating layer on an outer circumferential surface of a load support member. Electricity is supplied to an inner circumferential surface and an outer circumferential surface of the resistive heating layer in a direction perpendicular to the resistive heating layer.
Public/Granted literature
- US20110013955A1 HEATING MEMBER HAVING RESISTIVE HEATING LAYER AND FUSING DEVICE USING THE SAME Public/Granted day:2011-01-20
Information query
