Invention Grant
- Patent Title: Communication apparatus
- Patent Title (中): 通讯设备
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Application No.: US12757680Application Date: 2010-04-09
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Publication No.: US08331859B2Publication Date: 2012-12-11
- Inventor: Itaru Maekawa
- Applicant: Itaru Maekawa
- Applicant Address: JP Tokyo
- Assignee: Sony Corporation
- Current Assignee: Sony Corporation
- Current Assignee Address: JP Tokyo
- Agency: Finnegan, Henderson, Farabow, Garrett & Dunner LLP
- Priority: JPP2009-102507 20090420
- Main IPC: H04B5/00
- IPC: H04B5/00 ; H01Q1/38

Abstract:
A communication apparatus includes: a communication circuit section that processes a high-frequency signal for transferring data; a transfer path for the signal connected to the circuit section; a ground; a coupling electrode supported opposite and away in height from the ground; a resonance section that increases a current flowing into the electrode via the path; and a main body housing that assumes a plurality of placement postures and houses the respective components, one end surface of the housing serving as a reading surface in which the electrode is disposed offset from a center of the reading surface. An infinitesimal dipole is formed from a line segment connecting between a center of a charge in the electrode and a center of an image charge in the ground. The signal is transferred toward a communication partner disposed oppositely to form an angle of substantially 0 degrees with a direction of the dipole.
Public/Granted literature
- US20100267336A1 COMMUNICATION APPARATUS Public/Granted day:2010-10-21
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