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US08334027B2 Method for DC plasma assisted chemical vapor deposition in the absence of a positive column 有权
在没有正性柱的情况下进行直流等离子体辅助化学气相沉积的方法

Method for DC plasma assisted chemical vapor deposition in the absence of a positive column
Abstract:
In the method for depositing a material in the absence of a positive column, a discharge is generated between a cathode and an anode disposed to face each other in a reaction chamber by applying a DC voltage therebetween, and introducing reaction gas into the reaction chamber, thereby depositing a material on a substrate mounted on the anode and serving as a part of the anode, wherein the deposition of the material on the substrate is performed under a state that a cathode glow and an anode glow exist in a form of thin layers coating respectively the surfaces of the cathode and the substrate, while a positive column does not exist or is so small as to be negligible.
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