Invention Grant
- Patent Title: Sensor device and manufacturing method thereof
- Patent Title (中): 传感器装置及其制造方法
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Application No.: US12716436Application Date: 2010-03-03
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Publication No.: US08334158B2Publication Date: 2012-12-18
- Inventor: Toshihiko Takahata , Takashige Saito , Masahiro Honda , Shinpei Taga , Haruhisa Koike
- Applicant: Toshihiko Takahata , Takashige Saito , Masahiro Honda , Shinpei Taga , Haruhisa Koike
- Applicant Address: JP Kariya
- Assignee: DENSO CORPORATION
- Current Assignee: DENSO CORPORATION
- Current Assignee Address: JP Kariya
- Agency: Posz Law Group, PLC
- Priority: JP2009-50454 20090304
- Main IPC: H01L21/00
- IPC: H01L21/00
Abstract:
In manufacturing a sensor device, a sensor chip having a sensing portion on a surface thereof is mounted on one surface of a substrate, and a resin having a volatile property is arranged on the surface of the sensor chip, thereby covering the surface of the sensor chip. Then, the sensor chip and the substrate are sealed by a sealing member. After that, the sealing member is cured, and the resin is heated to be vaporized so that a void is formed between a covered portion in the surface of the sensor chip, which is covered by the sealing member, and the sealing member.
Public/Granted literature
- US20100224945A1 SENSOR DEVICE AND MANUFACTURING METHOD THEREOF Public/Granted day:2010-09-09
Information query
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