Invention Grant
- Patent Title: Solid-state imaging device, method of manufacturing solid-state imaging device, method of driving solid-state imaging device, and electronic apparatus
- Patent Title (中): 固态成像装置,制造固态成像装置的方法,驱动固态成像装置的方法和电子装置
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Application No.: US12695336Application Date: 2010-01-28
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Publication No.: US08334498B2Publication Date: 2012-12-18
- Inventor: Hideo Kanbe
- Applicant: Hideo Kanbe
- Applicant Address: JP Tokyo
- Assignee: Sony Corporation
- Current Assignee: Sony Corporation
- Current Assignee Address: JP Tokyo
- Agency: SNR Denton US LLP
- Priority: JP2009-025348 20090205
- Main IPC: H01L31/00
- IPC: H01L31/00

Abstract:
A solid-state imaging device includes: a substrate; a substrate voltage supply applying a first potential to the substrate during a light receiving period including first and second exposure periods different from each other and applying a second potential to the substrate during a no-light receiving period; and a plurality of pixels each including: a light receiving portion formed on a front surface side of the substrate and generating a signal charge in accordance with received light; a storage capacitor formed adjacent to the light receiving portion so that the signal charge generated in the light receiving portion is transmitted thereto and is stored and held therein when the first potential is applied to the substrate; dark current suppressing portions; an electronic shutter adjusting layer; a reading gate portion; and a vertical transmission register transmitting the signal charge read by the reading gate portion in the vertical direction.
Public/Granted literature
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