Invention Grant
US08334595B2 Silicon contactor including plate type powders for testing semiconductor device 有权
硅接触器包括用于半导体器件测试的板式粉末

  • Patent Title: Silicon contactor including plate type powders for testing semiconductor device
  • Patent Title (中): 硅接触器包括用于半导体器件测试的板式粉末
  • Application No.: US12937996
    Application Date: 2009-04-07
  • Publication No.: US08334595B2
    Publication Date: 2012-12-18
  • Inventor: Young Seok Jung
  • Applicant: Young Seok Jung
  • Applicant Address: KR Gyeonggi-do
  • Assignee: ISC Technology Co., Ltd.
  • Current Assignee: ISC Technology Co., Ltd.
  • Current Assignee Address: KR Gyeonggi-do
  • Agency: Ladas & Parry LLP
  • Priority: KR10-2008-0034696 20080415
  • International Application: PCT/KR2009/001793 WO 20090407
  • International Announcement: WO2009/128619 WO 20091022
  • Main IPC: H01L23/48
  • IPC: H01L23/48
Silicon contactor including plate type powders for testing semiconductor device
Abstract:
A silicon contactor of which a side contacts test terminals of a semiconductor testing device and of which an other side contacts ball leads of a semiconductor device so as to be used in the semiconductor testing device, including: conductive silicon parts which are formed opposite to the ball leads and/or the test terminals and include silicon rubber and conductive powders; and an insulating silicon part which is formed by filling silicon rubber among areas of the conductive silicon parts, which do not contact the ball leads, and supports the conductive silicon parts, wherein the conductive powders of the conductive silicon parts include plate type powders. Therefore, the plate type powders are used as the conductive powders of the conductive silicon parts to improve contact characteristics between the conductive silicon parts and the semiconductor device.
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