Invention Grant
- Patent Title: Multilayer electronic component and multilayer electronic component manufacturing method
- Patent Title (中): 多层电子元器件及多层电子元器件制造方法
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Application No.: US12765083Application Date: 2010-04-22
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Publication No.: US08334735B2Publication Date: 2012-12-18
- Inventor: Tomoshiro Isoshima
- Applicant: Tomoshiro Isoshima
- Applicant Address: JP Kyoto
- Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee Address: JP Kyoto
- Agency: Keating & Bennett, LLP
- Priority: JP2007-275587 20071023
- Main IPC: H03H7/00
- IPC: H03H7/00

Abstract:
A multilayer electronic component and a multilayer electronic component manufacturing method are capable of easily controlling the degree of magnetic field coupling between inductors. Via-hole conductors are arranged so that they extend in a lamination direction in a laminate, and function as a first inductor. Via-hole conductors are arranged so that they extend in the lamination direction in the laminate, and function as a second inductor. A first capacitor and the first inductor define a first resonance circuit. A second capacitor and the second inductor define a second resonance circuit. The via-hole conductors are arranged in a first insulating layer so that they are spaced apart from each other by a first distance. The via-hole conductors are arranged in a second insulating layer so that they are spaced apart from each other by a second distance that is different from the first distance.
Public/Granted literature
- US20100194498A1 MULTILAYER ELECTRONIC COMPONENT AND MULTILAYER ELECTRONIC COMPONENT MANUFACTURING METHOD Public/Granted day:2010-08-05
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