Invention Grant
- Patent Title: Electronic component
- Patent Title (中): 电子元器件
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Application No.: US12987198Application Date: 2011-01-10
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Publication No.: US08334746B2Publication Date: 2012-12-18
- Inventor: Yosuke Matsushita
- Applicant: Yosuke Matsushita
- Applicant Address: JP Kyoto
- Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee Address: JP Kyoto
- Agency: Keating & Bennett, LLP
- Priority: JP2008-183626 20080715
- Main IPC: H01F5/00
- IPC: H01F5/00

Abstract:
In an electronic component, a multilayer body includes a plurality of insulator layers stacked on top of one another. A first coil is provided in the multilayer body, includes a first coil axis and extends toward the positive side in the z-axis direction while circling counterclockwise around the first coil axis. A second coil is connected to the first coil, is provided in the multilayer body, includes a second coil axis, and extends toward the negative side in the z-axis direction while circling counterclockwise around the second coil axis. When viewed in plan from the z-axis direction, the first coil axis is disposed inside the second coil and the second coil axis is disposed inside the first coil.
Public/Granted literature
- US20110102124A1 ELECTRONIC COMPONENT Public/Granted day:2011-05-05
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