Invention Grant
- Patent Title: Method for manufacturing ceramic electronic component and ceramic electronic component
- Patent Title (中): 制造陶瓷电子部件和陶瓷电子部件的方法
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Application No.: US13357671Application Date: 2012-01-25
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Publication No.: US08334748B2Publication Date: 2012-12-18
- Inventor: Syunsuke Takeuchi , Teruyo Katayama , Toshiyuki Iwanaga , Akihiro Motoki , Makoto Ogawa , Kenichi Kawasaki
- Applicant: Syunsuke Takeuchi , Teruyo Katayama , Toshiyuki Iwanaga , Akihiro Motoki , Makoto Ogawa , Kenichi Kawasaki
- Applicant Address: JP Kyoto
- Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee Address: JP Kyoto
- Agency: Keating & Bennett, LLP
- Priority: JP2011-014225 20110126; JP2011-288154 20111228
- Main IPC: H01F5/00
- IPC: H01F5/00
Abstract:
A method for manufacturing a ceramic electronic component includes the steps of preparing a ceramic body including a plurality of first internal electrodes and a plurality of second internal electrodes, processing the ceramic body to an internal electrode exposure rate of about 102% to about 153%, and plating the processed ceramic body to form a plated layer thereon.
Public/Granted literature
- US20120188683A1 METHOD FOR MANUFACTURING CERAMIC ELECTRONIC COMPONENT AND CERAMIC ELECTRONIC COMPONENT Public/Granted day:2012-07-26
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