Invention Grant
- Patent Title: Non-volatile semiconductor storage device and method of manufacturing the same
- Patent Title (中): 非易失性半导体存储装置及其制造方法
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Application No.: US12886854Application Date: 2010-09-21
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Publication No.: US08335111B2Publication Date: 2012-12-18
- Inventor: Yoshiaki Fukuzumi , Ryota Katsumata , Megumi Ishiduki , Hideaki Aochi
- Applicant: Yoshiaki Fukuzumi , Ryota Katsumata , Megumi Ishiduki , Hideaki Aochi
- Applicant Address: JP Tokyo
- Assignee: Kabushiki Kaisha Toshiba
- Current Assignee: Kabushiki Kaisha Toshiba
- Current Assignee Address: JP Tokyo
- Agency: Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP2010-157822 20100712
- Main IPC: G11C16/04
- IPC: G11C16/04 ; H01L29/792 ; H01L21/336

Abstract:
A non-volatile semiconductor storage device includes: a memory string; a select transistor; and a carrier selection element. The select transistor has one end connected to one end of the memory string. The carrier selection element has one end connected to the other end of the select transistor, and selects a majority carrier flowing through respective bodies of the memory transistors and the select transistor. The carrier selection element includes: a third semiconductor layer; a metal layer; a second gate insulation layer; and a third conductive layer. The metal layer extends in the vertical direction. The metal layer extends in the vertical direction from the top of the third semiconductor layer. The second gate insulation layer surrounds the third semiconductor layer and the metal layer. The third conductive layer surrounds the third semiconductor layer and the metal layer via the second gate insulation layer and extends in a parallel direction.
Public/Granted literature
- US20120008400A1 NON-VOLATILE SEMICONDUCTOR STORAGE DEVICE AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2012-01-12
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