A method and circuit for implementing enhanced link bandwidth for a headless interconnect chip in a local rack interconnect system, and a design structure on which the subject circuit resides are provided. The headless interconnect chip includes a cut through switch and a store and forward switch. A packet is received from an incoming link to be transmitted on an outgoing link on the headless interconnect chip. Both the cut through switch and the store and forward switch are selectively used for moving packets received from the incoming link to the outgoing link on the headless interconnect chip.