Invention Grant
- Patent Title: Component placement apparatus, component placement setting calculation apparatus, program, and component placement setting calculation method
- Patent Title (中): 部件配置装置,部件配置设定计算装置,程序和部件配置设定计算方法
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Application No.: US12486070Application Date: 2009-06-17
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Publication No.: US08340803B2Publication Date: 2012-12-25
- Inventor: Takafumi Chida , Takahiro Nakano , Koichi Izuhara , Yoshiyuki Tsujimoto
- Applicant: Takafumi Chida , Takahiro Nakano , Koichi Izuhara , Yoshiyuki Tsujimoto
- Applicant Address: JP Gunma
- Assignee: Hitachi High-Tech Instruments Co., Ltd.
- Current Assignee: Hitachi High-Tech Instruments Co., Ltd.
- Current Assignee Address: JP Gunma
- Agency: Antonelli, Terry, Stout & Kraus, LLP.
- Priority: JP2008-242654 20080922
- Main IPC: G06F15/18
- IPC: G06F15/18

Abstract:
The present invention is directed to a technique that avoids occurrence of interference among multiple placement heads, when multiple placement heads simultaneously access a circuit board, and a pallet which is arranged in one direction with respect to the circuit board. When the component placement part 150 having the multiple placement heads simultaneously pick up the components from the pallet 160 and simultaneously place the components on the circuit board, the controller 140 specifies a pair of component groups to be picked up simultaneously from the pallet 160 by the multiple placement heads and places the components on the circuit board, so that an area where the multiple placement heads move in overlapping manner is minimized, and the placement heads respectively pick up the components included in the pair of component groups being specified and place the components on the circuit board.
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