Invention Grant
- Patent Title: Hinge assembly for foldable electronic device
- Patent Title (中): 可折叠电子装置的铰链总成
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Application No.: US12915038Application Date: 2010-10-29
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Publication No.: US08341805B2Publication Date: 2013-01-01
- Inventor: Chao Duan , Chia-Hua Chen
- Applicant: Chao Duan , Chia-Hua Chen
- Applicant Address: CN Shenzhen HK Kowloon
- Assignee: Shenzhen Futaihong Precision Industry Co., Ltd.,FIH (Hong Kong) Limited
- Current Assignee: Shenzhen Futaihong Precision Industry Co., Ltd.,FIH (Hong Kong) Limited
- Current Assignee Address: CN Shenzhen HK Kowloon
- Agency: Altis Law Group, Inc.
- Priority: CN201010247447 20100806
- Main IPC: E05F1/08
- IPC: E05F1/08

Abstract:
An exemplary hinge assembly includes a sleeve, a first member, a second member, a conductive member and a resilient member. The sleeve includes an open end. The first member is received in the sleeve. The conductive member is positioned on the first member. The second member is located next to the first member. One of the first member and the second member have a cam, the other of the first member and second member have a cam follower interacting with the cam so that the first member rotates about an axis and the second member moves linearly along the axis when the cam follower follows the cam. The resilient member is fitted in the sleeve and provides an elastic force to bias the first member and the second member into contact with each other. A plurality of tabs formed adjacent to the open end contact the conductive member for electronically connecting the sleeve to the first member.
Public/Granted literature
- US20120030905A1 HINGE ASSEMBLY FOR FOLDABLE ELECTRONIC DEVICE Public/Granted day:2012-02-09
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