A method for manufacturing a printed circuit board having a substrate composed of an insulation material, a via hole formed in the substrate, and a via land formed around the opening of the via hole on a surface of the substrate includes processes of measuring deformation of the substrate having the via hole formed therein, calculating a position where the via land is to be patterned on the basis of the deformation of the substrate measured in the measurement process, and patterning the via land at a position corrected on the basis of the value calculated in the calculation process.