Invention Grant
- Patent Title: Method for producing terminals
- Patent Title (中): 终端生产方法
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Application No.: US13003921Application Date: 2009-07-14
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Publication No.: US08341839B2Publication Date: 2013-01-01
- Inventor: Keiko Ishida
- Applicant: Keiko Ishida
- Applicant Address: JP Tokyo
- Assignee: Yazaki Corporation
- Current Assignee: Yazaki Corporation
- Current Assignee Address: JP Tokyo
- Agency: Sughrue Mion, PLLC
- Priority: JP2008-183889 20080715
- International Application: PCT/JP2009/062762 WO 20090714
- International Announcement: WO2010/007999 WO 20100121
- Main IPC: H01R43/00
- IPC: H01R43/00

Abstract:
The goal is to enhance the productivity by reducing the cost of a die. A method for selectively forming a female terminal (30) and a male terminal (40), each terminal having a square tubular box portion (31, 41) in its front and a wire crimping portion (38, 39, 48, 49) in its rear, from blanks (20) punched into a common shape is provided. In a step of punching the blank, a front projection (22) which becomes a spring piece (32) when the female terminal is produced and becomes a male tab (42) when the male terminal is produced is projected from the front end of a strip-like base plate (21) constituting a bottom plate of the square tubular box portion, and a blank in which right and left projections (28, 29) constituting the wire crimping portions are projected is formed in the rear of the base plate. In the subsequent pressing step, the female terminal and the male terminal are selectively formed in response to whether the front projection (22) is folded backward or left as it is, while the blank is made common for the box portions.
Public/Granted literature
- US20110119913A1 METHOD FOR PRODUCING TERMINALS Public/Granted day:2011-05-26
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