Invention Grant
- Patent Title: Profiled rail system
- Patent Title (中): 型轨系统
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Application No.: US12315033Application Date: 2008-11-26
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Publication No.: US08341909B2Publication Date: 2013-01-01
- Inventor: Frank Sondermann
- Applicant: Frank Sondermann
- Applicant Address: DE Luedenscheid
- Assignee: Herm. Friedr. Kuenne GmbH & Co.
- Current Assignee: Herm. Friedr. Kuenne GmbH & Co.
- Current Assignee Address: DE Luedenscheid
- Agency: Epstein Drangel LLP
- Agent Robert L. Epstein
- Priority: DE202007016585U 20071126
- Main IPC: E04F15/14
- IPC: E04F15/14

Abstract:
The Profiled rail system (1) serves for bridging expansion joints, cavities and as an edging of floor coverings (3). System (1) has at least one web (9) aligned substantially parallel to the floor covering (3), which web (9) engages displaceably in a pocket (10). Pocket (10) is formed by a cover plate (13) overlapping the web (9) and a base plate (14) under the web (9). Pocket (10) is configured in at least two parts (11, 12). The first part (11) forms cover plate (13). The second part (12) forms base plate (14). The first part (11) and the second part (12) are held together. In a first embodiment, a undercut web (20) holds the parts together by a click connection. In a second embodiment, the parts are held together by at least one screw (18).
Public/Granted literature
- US20090133349A1 Profiled rail system Public/Granted day:2009-05-28
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