Invention Grant
- Patent Title: Cutting and/or forming plate workpieces
- Patent Title (中): 切割和/或成形板工件
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Application No.: US12579558Application Date: 2009-10-15
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Publication No.: US08341990B2Publication Date: 2013-01-01
- Inventor: Stefan Buettner
- Applicant: Stefan Buettner
- Applicant Address: DE Ditzingen
- Assignee: TRUMPF Werkzeugmaschinen GmbH + Co. KG
- Current Assignee: TRUMPF Werkzeugmaschinen GmbH + Co. KG
- Current Assignee Address: DE Ditzingen
- Agency: Fish & Richardson P.C.
- Priority: EP08018315 20081020
- Main IPC: B21C51/00
- IPC: B21C51/00
Abstract:
A method for processing a plate workpiece supported on a workpiece support. The method includes moving a tool die and a tool punch along a stroke axis and toward a processing position above a support plane of the workpiece support. The processing position corresponds to a region of the plate workpiece having a formed shape, which extends upwardly from the support plane of the workpiece support.
Public/Granted literature
- US20100095726A1 CUTTING AND/OR FORMING PLATE WORKPIECES Public/Granted day:2010-04-22
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