Invention Grant
- Patent Title: Roller hemming with in-situ adhesive curing
- Patent Title (中): 滚筒折边用原位胶粘剂固化
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Application No.: US12774242Application Date: 2010-05-05
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Publication No.: US08341992B2Publication Date: 2013-01-01
- Inventor: Sampath K. Vanimisetti , Rajesh Raghavan , John E. Carsley
- Applicant: Sampath K. Vanimisetti , Rajesh Raghavan , John E. Carsley
- Applicant Address: US MI Detroit
- Assignee: GM Global Technology Operations LLC
- Current Assignee: GM Global Technology Operations LLC
- Current Assignee Address: US MI Detroit
- Agency: Quinn Law Group, PLLC
- Main IPC: B21D7/02
- IPC: B21D7/02

Abstract:
An apparatus for hemming multiple panels includes an anvil having a first panel and a second panel supported thereon. A roller mechanism and a curing mechanism are mounted to the hemming apparatus. The roller mechanism is adapted to move relative to the panels to fold a flanged portion of the first panel onto an edge portion of the second panel to form a joint. The curing mechanism is adapted to move relative to the panels to cure an adhesive located within the joint formed between the first panel and the second panel. The curing mechanism is located proximate to the roller mechanism, such that the first panel and the second panel may be supported by the anvil while the curing mechanism at least partially cures the adhesive.
Public/Granted literature
- US20110271728A1 ROLLER HEMMING WITH IN-SITU ADHESIVE CURING Public/Granted day:2011-11-10
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