Invention Grant
- Patent Title: Systems and methods for insert-molding
- Patent Title (中): 插入成型的系统和方法
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Application No.: US12624886Application Date: 2009-11-24
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Publication No.: US08342228B2Publication Date: 2013-01-01
- Inventor: Emery Sanford , Ed Holman
- Applicant: Emery Sanford , Ed Holman
- Applicant Address: US CA Cupertino
- Assignee: Apple Inc.
- Current Assignee: Apple Inc.
- Current Assignee Address: US CA Cupertino
- Agency: Womble Carlyle Sandridge & Rice LLP
- Main IPC: B22C9/22
- IPC: B22C9/22 ; B22D19/00

Abstract:
The present invention includes systems and methods for insert-molding. In some embodiments, a hook can be formed in a metal part by passing die-steel of a die-cast mold through the metal part during a die-casting process. This may, however, result in a hole in the metal part that is beneath the hook area. When plastic material is insert-molded over the metal part, the plastic material may flow through the hole and into the metal part. Accordingly, in some embodiments the plastic material can be prevented from flowing through the hole during the insert-molding. As one example, a tape material can be coupled over the hole. As another example, a wedge can be press-fit into the hole. As yet another example, a plug can be inserted into the hole.
Public/Granted literature
- US20100147482A1 SYSTEMS AND METHODS FOR INSERT-MOLDING Public/Granted day:2010-06-17
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