Invention Grant
- Patent Title: Plasma-driven cooling heat sink
- Patent Title (中): 等离子驱动冷却散热片
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Application No.: US12157232Application Date: 2008-06-08
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Publication No.: US08342234B2Publication Date: 2013-01-01
- Inventor: Chien Ouyang
- Applicant: Chien Ouyang
- Agent Bo-In Lin
- Main IPC: F28F7/00
- IPC: F28F7/00 ; H05K7/20

Abstract:
A plasma-driven cooling device generates and drives a plasma-driven gas flow to cool down electronic devices. The plasma-driven cooling device comprises electrodes, dielectric pieces, and heat sink fins. The voltages applied on the electrodes coupled with dielectric pieces and heat sink fins induce the gas flow, which is used to cool down heat sources. A magnetic circuit may be coupled with plasma-drive gas flow to enhance the cooling.
Public/Granted literature
- US20080302510A1 Plasma-driven cooling heat sink Public/Granted day:2008-12-11
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