Invention Grant
- Patent Title: Method for the production of a metal-ceramic substrate, preferably a copper ceramic substrate
-
Application No.: US13441353Application Date: 2012-04-06
-
Publication No.: US08342384B2Publication Date: 2013-01-01
- Inventor: Jürgen Schulz-Harder
- Applicant: Jürgen Schulz-Harder
- Applicant Address: DE Eschenbach
- Assignee: Curamik Electronics GmbH
- Current Assignee: Curamik Electronics GmbH
- Current Assignee Address: DE Eschenbach
- Agency: Welsh Flaxman & Gitler LLC
- Priority: DE10211268 20020313; DE10212495 20020321
- Main IPC: B23K20/12
- IPC: B23K20/12
Abstract:
The invention relates to a novel process for producing a metal ceramic substrate, especially a copper-ceramic substrate, in which at least one metal foil at a time is applied to the surface sides of a ceramic layer or a ceramic substrate using a high temperature bonding process and the metal foil is structured on at least one surface side for forming conductive tracks, contact surfaces, and the like.
Public/Granted literature
- US20120193324A1 METHOD FOR THE PRODUCTION OF A METAL-CERAMIC SUBSTRATE, PREFERABLY A COPPER CERAMIC SUBSTRATE Public/Granted day:2012-08-02
Information query
