Invention Grant
US08342416B2 Wireless IC device, wireless IC module and method of manufacturing wireless IC module
有权
无线IC器件,无线IC模块及制造无线IC模块的方法
- Patent Title: Wireless IC device, wireless IC module and method of manufacturing wireless IC module
- Patent Title (中): 无线IC器件,无线IC模块及制造无线IC模块的方法
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Application No.: US13169067Application Date: 2011-06-27
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Publication No.: US08342416B2Publication Date: 2013-01-01
- Inventor: Noboru Kato
- Applicant: Noboru Kato
- Applicant Address: JP Kyoto
- Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee Address: JP Kyoto
- Agency: Keating & Bennett, LLP
- Priority: JP2009-003315 20090109; JP2009-019695 20090130; JP2009-210723 20090911
- Main IPC: G06K19/06
- IPC: G06K19/06

Abstract:
A wireless IC module that can function as a component of an RFID system even when mounted on a metal article includes a loop-shaped electrode that is constructed such that a plane of a loop of the loop-shaped electrode is substantially perpendicular to the mounting surface of a wireless IC module. The loop-shaped electrode functions as a magnetic field antenna and is electromagnetically coupled with a metal article so that the surface of the metal article functions as a radiator antenna.
Public/Granted literature
- US20110253795A1 WIRELESS IC DEVICE, WIRELESS IC MODULE AND METHOD OF MANUFACTURING WIRELESS IC MODULE Public/Granted day:2011-10-20
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