The present disclosure provides a novel suspension device used in producing a composition, such as, but not limited to, a polyimide composition. The suspension device in its most general form comprises a support element and an attachment element. The attachment element is in communication at one of its ends with the support element and at the other with a workpiece, such as a poly(amic acid) or polyimide workpiece. The suspension device may further comprise additional elements. The suspension device maintains the workpiece in a suspended state during processing so as to reduce or eliminate processing-related defects.