Disclosed is an coating/developing apparatus and method thereof in which the processing time is shortened and the foot prints is reduced by shortening the travel distance of a wafer transfer arm. The coating/developing apparatus of the present disclosure includes, inter alia, liquid processing part (COT) that processes the substrate using a liquid, a cooling processing part (CA) provided to correspond to the liquid processing part (COT) and perform the cooling process for the substrate, a liquid processing unit (COTU) provided to correspond to the cooling processing part (CA) and equipped with a heating processing part (HP) that performs a heating processing for the substrate. The cooling processing part (CA) transfers the substrate to/from the liquid processing part (COT) and the heating processing part (HP).