Invention Grant
- Patent Title: Key cutting machine
- Patent Title (中): 钥匙切割机
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Application No.: US12156920Application Date: 2008-06-05
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Publication No.: US08342783B2Publication Date: 2013-01-01
- Inventor: Richard W. Ryai, Sr.
- Applicant: Richard W. Ryai, Sr.
- Applicant Address: US OH Northfield
- Assignee: Hy-Ko Products Co.
- Current Assignee: Hy-Ko Products Co.
- Current Assignee Address: US OH Northfield
- Agency: McDonald Hopkins LLC
- Main IPC: B23C3/35
- IPC: B23C3/35

Abstract:
A key cutting machine is provided for cutting a key blank from a master key. The key cutting machine comprises a first cutting member that rotates about a substantially horizontal axis for cutting a key pattern on a key blank and a second cutting member that rotates about a substantially vertical axis for cutting a key pattern on a key blank. Additional improvements or features of a key cutting machine are also described.
Public/Granted literature
- US20080247834A1 Key cutting machine Public/Granted day:2008-10-09
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