Invention Grant
US08342873B2 Electrical socket having suitable receiving space for a solder ball of an IC package
有权
电插座具有用于IC封装的焊球的合适的容纳空间
- Patent Title: Electrical socket having suitable receiving space for a solder ball of an IC package
- Patent Title (中): 电插座具有用于IC封装的焊球的合适的容纳空间
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Application No.: US13213105Application Date: 2011-08-19
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Publication No.: US08342873B2Publication Date: 2013-01-01
- Inventor: Fang-Jwu Liao , Ke-Hao Chen , Chun-Fu Lin
- Applicant: Fang-Jwu Liao , Ke-Hao Chen , Chun-Fu Lin
- Applicant Address: TW New Taipei
- Assignee: Hon Hai Precision Ind. Co., Ltd
- Current Assignee: Hon Hai Precision Ind. Co., Ltd
- Current Assignee Address: TW New Taipei
- Agent Wei Te Chung; Ming Chieh Chang
- Main IPC: H01R13/625
- IPC: H01R13/625
Abstract:
An electrical socket used to connecting an IC package to a printed circuit board comprises an insulative housing (2) and a plurality of contacts (1) received therein, the insulative housing (2) comprises a top surface (21), a bottom surface (22) opposite to the top surface (21) and a plurality of passageways (211) penetrated the top surface (21) and the bottom surface (22), the contact (1) comprises a body portion (10), a connecting portion (11) extending upwardly from the body portion (10) and a spring portion (12) extending horizontally from the connecting portion (11), the spring portion (12) comprises a supporting portion (120) at the end thereof touching with the insulative housing (2).
Public/Granted literature
- US20120045946A1 SOCKET CONNECTOR HAVING SUITABLE RECEIVING SOLDER LEAD FROM IC PACKAGE Public/Granted day:2012-02-23
Information query
