A conditioning and cutting apparatus for a blade is provided. The apparatus may include a cutting board and a conditioning device. The cutting board may include a top cutting surface, a bottom surface disposed in opposition to the top cutting surface, and a peripheral wall extending between the top cutting surface and the bottom surface and defining the perimeter of the cutting board. The cutting board may define a channel therein. The channel may define a recess and an opening thereto. The peripheral wall may define the opening of the channel. The conditioning device may be disposed in the channel. The conditioning device may be configured to interact with the blade as the blade is drawn through the channel.