Invention Grant
- Patent Title: Polymer pi-bond-philic filler composites
- Patent Title (中): 聚合物亲环键填料复合材料
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Application No.: US12623355Application Date: 2009-11-20
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Publication No.: US08343257B2Publication Date: 2013-01-01
- Inventor: Scott T. Matteucci , Shawn D. Feist , Peter N. Nickias , Leonardo C. Lopez , Michael S. Paquette , Jeffrey C. Munro
- Applicant: Scott T. Matteucci , Shawn D. Feist , Peter N. Nickias , Leonardo C. Lopez , Michael S. Paquette , Jeffrey C. Munro
- Applicant Address: US MI Midland
- Assignee: Dow Global Technologies LLC
- Current Assignee: Dow Global Technologies LLC
- Current Assignee Address: US MI Midland
- Main IPC: B01D53/22
- IPC: B01D53/22 ; B01D71/02 ; B01D71/06 ; C08J5/22
Abstract:
The instant invention generally provides polymer pi-bond-philic filler composite comprising a molecularly self-assembling material and a pi-bond-philic filler, and a process of making and an article comprising the polymer pi-bond-philic filler composite. The instant invention also generally provides a process of separating a pi-bond-philic gas from a separable gas mixture comprising the pi-bond-philic gas.
Public/Granted literature
- US20100126341A1 POLYMER PI-BOND-PHILIC FILLER COMPOSITES Public/Granted day:2010-05-27
Information query
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