Invention Grant
- Patent Title: Surface processing method for mounting stage
- Patent Title (中): 表面处理方法安装阶段
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Application No.: US12057975Application Date: 2008-03-28
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Publication No.: US08343372B2Publication Date: 2013-01-01
- Inventor: Tadashi Aoto , Eiichiro Kikuchi , Masakazu Higuma , Kimihiro Higuchi
- Applicant: Tadashi Aoto , Eiichiro Kikuchi , Masakazu Higuma , Kimihiro Higuchi
- Applicant Address: JP Tokyo
- Assignee: Tokyo Electron Limited
- Current Assignee: Tokyo Electron Limited
- Current Assignee Address: JP Tokyo
- Agency: Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP2007-092378 20070330
- Main IPC: B29C61/04
- IPC: B29C61/04 ; H05H1/00
Abstract:
A surface processing method for a mounting stage, which enables a mounting surface conforming to a substrate to be formed while saving time and effort. The substrate is mounted on a mounting surface of the mounting stage disposed in a housing chamber of a substrate processing apparatus that carries out plasma processing on the substrate. The mounted substrate is thermally expanded.
Public/Granted literature
- US20080237030A1 SURFACE PROCESSING METHOD FOR MOUNTING STAGE Public/Granted day:2008-10-02
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